Aluminum cavity is widely applied in electronic, communication, electrical appliance and other industries. It requires to be plated a silver deposit inside for shielding the signal. Due to the reactivity of Aluminum, great expansion coefficient, complex structure and large size, it is difficult to plate silver on the aluminum directly. Through the copper cyanide or copper pyrophosphate plating process to create a copper deposit can solve this problem well. Univertical’s oxygen-free copper anode features a high purity and fine grain structure. It has obvious quality advantage compared with traditional electrolytic copper and can effectively improve product stability when matched with Univertical’s copper pyrophosphate and potassium pyrophosphate.

Application of products: Oxygen free copper anode, copper pyrophosphate and potassium pyrophosphate.