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Univertical International (Suzhou) Co., Ltd.
Tel: +86-512-6661-0088
Fax: +86-512-6661-3128
Address: No.567 Jinfeng Road, Suzhou New District, Jiangsu Province, P.R. China

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Lead frame, as a chip carrier of an integrated circuit, is a key structural member realizing electrical connection between internal circuit leading-out terminal of the chip and outer lead by right of bonding material (gold wire, aluminum wire and copper wire) and forming electric loop. It plays a role of bridge connecting with external conductors. Most semiconductor integrated packages need lead frame, which is an important base material in the electronic information industry. Lead frame plating refers to special surface treatment in the mounting/bonding area (terminal pin and island), which is mainly to ensure the mounting/bonding performance in packaging process and to make the chip and welding wire form good diffusion welding with the lead frame. It is copper pre-plating, then nickel plating and finally silver or gold plating generally. Univertical’s oxygen-free copper anode features a high purity and fine grain structure. It has obvious quality advantage compared with traditional electrolytic copper and can effectively improve product stability when matched with Univertical’s copper pyrophosphate and potassium pyrophosphate. Univertical’s nickel sulfamate is made of high-quality metal nickel with advanced American process, ensuring product stability and the lowest internal stress in the industry.


Product Application: Oxygen free copper anode, copper pyrophosphate, potassium pyrophosphate and nickel sulfamate solution

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