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Copper pyrophosphate

√ High purity, very low impurities, more easily complexed by potassium pyrophosphate √ The product enables the plating solution to have excellent polarization ability, current dispersion ability, stable plating solution, strong anti-interference ability, simple maintenance and cost saving √ It is better to use it with excellent oxygen free copper anode and potassium pyrophosphate

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Copper pyrophosphate

Enclosure:

CAN22-099141-29_EC_F_Copper Pyrophosphate.PDF

E-UI-CPC-1 SDS-Copper Pyrophosphate 20220427.pdf

Graphic details

Copper pyrophosphate

1 Quality of excellent resistance:

√ High purity, extremely low impurities, more easily complexed by potassium pyrophosphate

√ The product enables the plating solution to have excellent polarization ability, current dispersion ability, stable plating solution, strong anti-interference ability, simple maintenance and cost saving

√ It is better to use it with excellent oxygen free copper anode and potassium pyrophosphate

2 Application field：Bathroom hardware, plastic electroplating

3 Specific Gravity:

project	Typical detection value	Specifications
Copper pyrophosphate tetrahydrate	99.5%	99.0% minimum
copper	33.9%	33.7% minimum
arsenic	1.2 ppm	3.0 ppm maximum
iron	25.2 ppm	50.0 ppm maximum
lead	2.3 ppm	5.0 ppm maximum
Insoluble in H₂SO₄	0.05%	0.10% maximum
Sulfate	0.3%	0.5% maximum
Solubility in potassium pyrophosphate solution	≥99.90%	99.90% minimum
Hull cell test D_k	11.2 A/dm²	10.0 A/dm² minimum